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arXiv:1512.08291 (cs)
[Submitted on 27 Dec 2015 (v1), last revised 28 Feb 2016 (this version, v5)]

Title:ePlace-3D: Electrostatics based Placement for 3D-ICs

Authors:Jingwei Lu, Hao Zhuang, Ilgweon Kang, Pengwen Chen, Chung-Kuan Cheng
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Abstract:We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform smoothness (2) 3D numerical solution with improved spectral formulation (3) 3D nonlinear pre-conditioner for convergence acceleration (4) interleaved 2D-3D placement for efficiency enhancement. Our placer outperforms the leading work mPL6-3D and NTUplace3-3D with 6.44% and 37.15% shorter wirelength, 9.11% and 10.27% fewer 3D vertical interconnects (VI) on average of IBM-PLACE circuits. Validation on the large-scale modern mixed-size (MMS) 3D circuits shows high performance and scalability.
Comments: 8 pages, 7 figures, ISPD 2016
Subjects: Other Computer Science (cs.OH)
Cite as: arXiv:1512.08291 [cs.OH]
  (or arXiv:1512.08291v5 [cs.OH] for this version)
  https://doi.org/10.48550/arXiv.1512.08291
Related DOI: https://doi.org/10.1145/2872334.2872361

Submission history

From: Jingwei Lu [view email]
[v1] Sun, 27 Dec 2015 23:55:38 UTC (4,943 KB)
[v2] Wed, 30 Dec 2015 06:39:58 UTC (4,992 KB)
[v3] Sat, 30 Jan 2016 19:48:21 UTC (4,993 KB)
[v4] Thu, 4 Feb 2016 23:09:07 UTC (4,992 KB)
[v5] Sun, 28 Feb 2016 06:22:02 UTC (5,013 KB)
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Jingwei Lu
Hao Zhuang
Ilgweon Kang
Pengwen Chen
Chung-Kuan Cheng
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