BibTeX records: Y. Lamy

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@inproceedings{DBLP:conf/3dic/LamyDBFSDV13,
  author       = {Y. Lamy and
                  Laurent Dussopt and
                  Ossama El Bouayadi and
                  C. Ferrandon and
                  Alexandre Siligaris and
                  Cedric Dehos and
                  Pierre Vincent},
  title        = {A compact 3D silicon interposer package with integrated antenna for
                  60GHz wireless applications},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702345},
  doi          = {10.1109/3DIC.2013.6702345},
  timestamp    = {Thu, 05 Nov 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/LamyDBFSDV13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}